- Interconnect

• BEOL Integration, Metallization & Low-k Dielectrics
• Advanced Interconnect Materials (Cu, Ru, Mo, CNT, Graphene, etc.)
• Thin-Film Deposition (Electrodeposition, ALD, CVD, PVD, etc)
• CMP & Planarization Technologies
• Barrier, Liner, Contact & Via Technologies
• Interconnect Modeling, Reliability & Failure Analysis
• Backside Power Delivery & Advanced Interconnect Architectures

- Package

• Heterogeneous Integration & Chiplet Packaging
• 2.5D/3D Integration & HBM Packaging
• Fan-Out WLP/FOPLP & Panel-Level Packaging
• Package Interconnects (RDL, Substrate, Silicon/Glass Interposers, TSV, TGV, etc.)
• Glass Interposer & Glass Core Packaging
• Hybrid Bonding & Wafer-to-Wafer/Die-to-Wafer Integration
• Optical & Co-packaged Optical Interconnects
• Packaging Materials, Assembly & Reliability
• Thermal Management & Power Delivery
• Package Design, Simulation & Testing

• Optical Lithography
• Electron-beam Lithography
• EUV Lithography
• Photoresist and Patterning Materials
• Block Copolymer Self-assembly/Photolithography Fusion Technology
• Innovative Patterning Methods
• Simulation and Optical Proximity Correction
• Plasma Etching for Semiconductor Devices
• Plasma Diagnostics and Monitoring
• Atomic Layer Etching
• Modeling and Simulation for Etching
• Plasma Source and RF Technology
• Plasma Equipment and Components
• Vapor Phase Etching
• Cryogenic and Low Temperature Etching
• Wet Etching

• Bulk and Nano-Structured Growth and Characterization of IV, III–V, and II–VI Compound Semiconductors
• Epitaxial Growth of Thin Films and Nanostructures, Including IV, IV–IV, III–V, and II–VI Compound Semiconductors
• Epitaxy and Characterization of Si-Based Materials, Including Si, SiGe, SiC, and III–V Materials on Si
• Selective Epitaxy and Regrowth for Device Applications
• Growth of Nanostructures for Nitride and Oxide Semiconductors
• Bottom-Up Growth of Nanohybrid Structures and Their Applications
• Advanced and Emerging Characterization Methods for Materials and Devices
• Growth and Characterization of Carbon-Related Materials, Including Graphene, Graphene Oxide, Graphite, Carbon Nanotubes, and Related Materials
• Growth, Characterization, and Applications of 2DEG Systems, Perovskites, and Colloidal Quantum Dots
• Materials for Solar Cells, Including Si, III–V, CIGS, CdTe, and Related Photovoltaic Materials
• Emerging Materials for Electronic and Optical Devices
• Wide-Bandgap Material Synthesis, Including Diamond, Oxides, Nitrides, and Related Materials
• Design, Synthesis, and Characterization of Advanced Oxide Materials
• Synthesis and Characterization of Two-Dimensional Materials and Van der Waals Heterostructures

• Advanced Gate Stack, Channel Process, and Integration Technology
• Novel Thin Film Processes
• Advanced DRAM Capacitor Materials and Devices
• New Memory Materials and Devices
• Thin Film Transistor (TFT) Process and Materials
• Thin Film Processes for Interconnect
• Sensor Materials and Devices
• Compound Semiconductor Materials and Devices
• Organic and Organic-inorganic Hybrid Films
• Carbonic or Dichalcogenide 2D Materials and Devices
• Low Temperature(< 100°C) Thin Film Deposition and Applications
• Thin Film Characterization Methodologies
• Thin Film Deposition and Treatment Apparatus for Mass Production

• Compound Semiconductor Materials and Devices
• Wide Bandgap and Ultra-wide Bandgap Semiconductors (SiC, GaN, AlN, Ga2O3, Diamond, etc)
• Diodes, Transistors, and Other Electronic Devices
• LEDs, LDs, Photodiodes, and Other Optical Devices
• Novel Compound Semiconductor Devices and Sensors
• Compound Semiconductor IC Including RFICs, MMICs and HICs
• Compound Semiconductor Process Technologies
• Compound Semiconductor Manufacturing and Packaging Technologies
• High Frequency and High Power Electronic Devices
• Reliability, ESD, and Quality Improving Technologies

• Advanced CMOS Device and Processes (e.g. FINFET. MBCFET, CFET, etc)
• Novel CMOS Devices and Processes (e.g. TFET, NCFET, junctionless FET, etc.)
• Novel Materials and Processes for Advanced CMOS Devices (e.g. SiGe, Ge, GeSn, channel, junction, gate stack, contact, etc.)
• Test Structures and Metrologies of CMOS Devices and Processes
• Reliability Issues in Devices and Processes (eg. HCI, BTI, self-heating, etc.)
• Management of Variations in Devices and Processes
• Si CMOS-Compatible Novel Synaptic Devices and Neuronic Circuitry
• Si and Group-IV Photonic Devices and Electronics/Photonics Convergence
• 3D NAND Flash Memory & Integration
• 3D DRAM Memory & Integration
• Novel Device and Circuit Co-Optimization
• Analog/RF Devices and Processes
• High-Voltage and Power Devices and Processes
• Embedded Non-Volatile Memory and Process Integration

• Device/Process Modeling and Simulation (Compact Modeling, Particle or Continuum-level Device/Process Simulations, Atomistic Approaches for Growth, Fabrication, Transport Simulations, etc.)
• Modeling and Simulation for Novel Semiconductor Devices (FinFETs, Ultra-Thin-Body MOSFETs, III-V MOSFETs, Tunnel FETs, Spintronic FETs, Carbon-based FETs, Charge Trap Devices, 3D DRAM, Emerging Memories, Neuromorphic Devices, etc.)
• Device Characterization, Variability and Yield (Device Model-Parameter Extraction, Random Dopant Fluctuations, Random Telegraph Noise, Yield Analysis, etc.)
• Reliability (Hot Carrier Effect, Time-Dependent Dielectric Breakdown, Device Degradation, Bias-Temperature Instability, Illumination effect on BTI, Electrical Overstress, Electrostatic Discharge (ESD) effects, etc.)
• Semi-Classical/Quantum Transport and Simulation of Nano-scale FET devices

• Active Matrix Devices
• Liquid Crystal Technology
• Organic Light Emitting Displays
• Micro-LED and Inorganic Semiconductor Displays
• Quantum Dot Displays
• Display Packaging
• Lighting
• Flexible and Stretchable Displays
• Display Manufacturing and Equipment
• Imaging Technologies
• Display and Imaging Device Driving Technology
• Circuits for Display and Imaging Device
• Display and Imaging Optics
• MEMS Displays
• Touch Panel Technology
• VR/AR/XR and 3D Displays
• Display and Imaging Device Application in IoT
• AI Technology for Displays

• Macro/Meso/Micro/Nano/Quantum Sensors & Systems
• Mechanical/Thermal/Magnetic/RF/Optical/Radiation/Chemical/Bio/Medical Sensors & Systems
• Smart/Intelligent/Integrated/Edge/IoT Sensors & Systems
• Flexible, Wearable & Stretchable Sensors and Systems
• MEMS, Microsystems & Nanosystems
• Bio/Biomedical MEMS and Sensors
• Brain-Computer/Neural Interfaces and Neural Devices
• Microfluidics and Lab-on-a-Chip
• Optical and RF MEMS
• Power Microsystems, Energy Harvesting & Self-powered Sensors
• Micro/Nano Materials, Fabrication & Integration
• Physically Unclonable Functions (PUFs) and True Random Number Generators (TRNGs)
• Neuromorphic and In-Sensor Computing Devices & Systems
• AI-enabled Sensors and Intelligent Sensing Systems

• Two-Dimensional Materials (TMDs, MXenes, h-BN, etc.)
• Carbon Nanomaterials (Graphene, CNT, etc.)
• Quantum Dots, Nanowires and Emerging Nanomaterials
• Soft, Organic and Hybrid Nanomaterials
• Nanofabrication, Self-Assembly and Nano Manufacturing
• Surface and Interface Engineering
• Nanoelectronics, Spintronics & Neuromorphic electronics
• Soft Electronics and Bioelectronics
• Nanooptoelectronics, Nanophotonics & Plasmonics
• Quantum Materials and Nanodevices
• Nanomaterials for Energy Conversion and Storage
• Nano Characterization and Metrology
• AI-enabled Nanotechnology and Data-driven Materials Discovery
• Theory, Modeling and Quantum Transport in Nanostructures

• Memory Process/Device Simulation
• New Memory Cells / Device Concepts & Innovations
• Memory Process Technology Innovation and Advanced Processes
• Circuits / Architectures / Design Methodologies / Process Technologies for Flash Memories, DRAMs, SRAMs, Nonvolatile Memories, CAMs, Cache Systems and Embedded Memories
• Memory and Solid-State Disk (SSD) Test, Yield/ Reliability Enhancement Techniques like Redundancy, BIST, ECC and Statistical Design
• New Memory Technologies for Emerging Applications such as Neuromorphic Computing and Logic-in-memory

• Analog Building Blocks
• Data Converters
• Power Circuits
• Energy Harvesting Circuits
• Display Driver ICs
• Image Sensors & Smart Sensors
• Clock Recovery & Generation
• Ultra Low Power Analog /Mixed-Signal Design Techniques
• Bio/Biomedical/Mobile Healthcare ICs
• Sensor Signal Conditioning Circuits
• MEMS Analog Circuits

• Front-end Circuits
• Transmitters and Power Amplifiers
• Oscillators and Frequency Synthesizers
• RF and Wireless Transceiver ICs
• Low Power Transceivers and Wireless Connectivity ICs
• High-speed Serial Interface Circuits
• Millimeter-Wave Circuits and Systems
• Terahertz Circuits and Systems

• Hardware/Software Co-design
• Logic Synthesis and Optimization
• Physical Design (Placement and Routing)
• Analysis, Simulation and Verification
• Signal Integrity Analysis and Optimization
• Low-power and High-performance Design
• Mixed-signal/RF Design Methodology
• Design Methodology for Neural Networks
• Testing, Design for Testability and Manufacturability
• CAD for Emerging Technologies and Applications
• Design Technology Co-Optimization (DTCO)
• Design Methodology for Standard Cell, Memory, and IP Module
• Library Characterization and PDK Development
• CAD for Advanced Packaging, Chiplets, and 2.5D/3D ICs

• Smart Systems for Automotive
• Personalized Healthcare Systems
• Processor and Multicore Architectures
• Internet of Things
• Big Data Processing
• Intelligent Security Systems
• Energy-aware Systems and Services
• Communications Circuits and Systems
• Sensory Circuits and Systems
• Digital Signal Processing
• Multimedia Systems and Applications
• Post-Quantum Cryptography

• Silicon Solar Cells and Technologies
• CIGS-II-VI and Related Thin Film Cells
• III-V Materials and Devices for Concentrator and Space PV Systems
• Photovoltaics with New Materials and Concepts
• PV Architecture and PV systems
• Power Devices (Si, Compound SC)
• Electrodes, Electrolytes, Separators and Systems for Energy Storage (batteries, capacitors, fuel cells, etc.)
• Photocatalysts and Photoelectrochemical Systems for Solar Fuels
• Nanogenerators and Self-powered Systems
• Thermoelectrics
• Radiative Cooling Technology

• Metrology and Inspection Methodologies (Device, Display, LED, Solar Cell, etc.)
• Critical Dimension and Mask Related Metrologies
• Overlay, Registration, and Alignment Metrologies
• Process Control and Characterization
• Defect Detection and Control
• Nanoanalysis with Structure, Surface, and Chemical Measurements
• Quality Assurance and Yield Enhancement
• Measurement System Modeling and Simulation
• A.I. (Artificial Intelligence) Application for Defect Analysis and Yield Enhancement

• Software Architecture for New Semiconductor Technology
• Simulation and Emulation Techniques for Storage Design
• Software for Fusion Semiconductor
• File System and FTL (Flash Translation Layer)
• Storage Algorithms & I/O Stack Analysis
• Virtualization for Memory and Storage
• Low Power & Bigdata Issues on Storage
• Memory Management and Caching Algorithms
• Machine Learning & Deep Learning Circuits and Systems
• Neuromorphic, Process-in-Memory (PIM), and Processing-Near-Memory (PNM) Systems
• Memory Hierarchy, IO, and On-Chip Communication Technique for AI systems
• Al Algorithm FPGA-based Implementation
• AI-Accelerated Systems and Applications
• AI Neural Network Design and Software Optimization
• AI Compilers, Runtimes, and Frameworks
• LLM & Generative AI System Architecture and Serving Optimization

• Chip Implementation Results from University (ASIC / FPGA)

• Bio/Biomedical/Neural Circuits and Systems
• Bio/Biomedical/Neural Devices
• Bio/Biomedical/Neural Signal Processing
• Biomedical Sensor Interfaces
• Brain Machine/Computer Interfaces
• Wireless Neural Data Communications
• Wireless Power Transfer for Bio Applications

• Solid-state Quantum Computing Devices (Superconducting Circuits, Semiconductor Spin Qubits, Quantum Defects etc.)
• Atomic, Molecular, Optics-Based Quantum Computing Devices (Neutral atoms, Ion traps, Integrated Photonic Circuits etc.)
• Quantum Communication Devices and Applications
• Quantum Sensing Devices and Applications
• Quantum Software: Theory and Experiments

TBA